AI and high performance computing are transforming data centers from traditional enterprise facilities into massive, power dense infrastructures. Raising process water and rack inlet temperatures improves overall energy efficiency, but it also shifts more thermal stress onto air side components. Conventional HVAC fans, often only designed for 50–60 °C operation, are now expected to run continuously in 70–80 °C air at higher static pressures, while still meeting strict noise and efficiency limits.
This presentation explores how high temperature rated EC fan platforms and large diameter modular axial fans can address this new thermal reality. We look at why integrated electronics fail faster in hot airflow, and how relocating drives out of the process airstream, ...