The rapid expansion of AI applications, cloud services, and data-intensive computing is driving a continuous increase in power density within modern data centers. As a result, cooling requirements are becoming more and more demanding. Traditional air-cooling systems are increasingly reaching their limits in terms of efficiency and performance, which is why liquid cooling technologies such as direct-to-chip and immersion cooling are becoming essential. These cooling systems consist of multiple critical components, including cold plates, distribution manifolds, heat exchangers, and piping systems that transport cooling media directly through the infrastructure. Since these fluids operate in close proximity to highly sensitive electronic components, absolute tightness is essential. Even th ...