16 - 18 October 2018 // Nuremberg, Germany

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Zoom product LOGO_Precision Connector Die

Precision Connector Die

LOGO_Precision Connector Die

Precision Connector Die

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Miniaturization, high density and high transmission speed are technology development direction of connector. To break through technology bottleneck of small interval micro connector and high-speed transmission connector is the challenge and technical requirement of connector die enterprises. Wuxi Micro Research developed step 1.5 third-generation backplate connector and step 1.4 fourth-generation backplate connector die, achieving the technological innovation of data transmission speed from 10M to 10G. Meanwhile, our company successfully developed submodule structure die form to cater to the requirement of lower product cost, achieving rapid die adjustment during production and improving stamping production efficiency.

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Other Progressive Dies

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Semiconductor Moulding dies

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Trimming and forming dies

LOGO_Trimming and forming dies

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